Qualcomm: Snapdragon 700 & 600 come as 5G chips for mid-range smartphones

by Kelvin
Qualcomm: Snapdragon 700 & 600 come as 5G chips for mid-range smartphones

By 2019 Qualcomm wants to supply its partners with cheaper 5G Snapdragons, first devices are to appear in 2020. The chips have integrated 5G modems and are manufactured using 7nm technology.

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Qualcomm Snapdragon SoCs with 5G Functionality | (c) Qualcomm


(c) Qualcomm

Qualcomm has announced cheaper Snapdragon SoCs with integrated 5G modem at the Ifa 2019 electronics show: The Snapdragon 700 and the Snapdragon 600 are expected to be in mid-range smartphones in 2020, as previous systems-on-a-chip such as the Snapdragon 855 are for expensive high-end devices thought and need for 5G a dedicated modem, which costs additional money.

The Snapdragon 700 and the Snapdragon 600, on the other hand, will integrate the 5G modem. The same applies to the Snapdragon 865, which Qualcomm plans to introduce in 2019. Also at least one Snapdragon 700 is to be announced by the end of the year, the SoC is according to Qualcomm produced in a 7-nm process. The US manufacturer had entered into a cooperation with Samsung Foundry for 5G chips, which is why the 7LPP process with EUV exposure is likely.

First smartphone with SD600 / 700 from 2020

Because partners will have access to the Snapdragon 700 from the end of 2019, the first smartphones will be released by 2020 – the Mobile World Congress in February would be a typical date for announcements. When to release the Snapdragon 600 with 5G modem, Qualcomm left open for the time being. They should be available in 2020, as 5G has to establish itself more broadly. Other manufacturers have introduced SoCs with integrated 5G modems.

From Samsung comes the Exynos 980, which is unlike the Exynos 9825 without 5G modem is not a high-end chip. Samsung uses its SoCs almost exclusively for its own devices, the same applies to Huawei: The Chinese have developed with the Kirin 990 a fast 5G SoC (and presented at the IFA 2019), which is produced at TSMC in N7 + called EUV node.

More about: IFA, new release

Source: Golem

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